The 200mm GaN Warpage Problem
The transition to 200mm GaN-on-Si is triggering a systemic yield crisis driven by mechanical wafer warpage. Epi yields are running 15-20% below silicon benchmarks. This report maps the bottlenecks, economics, and who controls capacity.
The 140-Qubit Cryostat Wall
The "High-Density Interconnect Bottleneck" renders legacy semi-rigid coaxial architectures unscalable beyond 140 qubits. This audit maps thermal death points, signal integrity crisis, and supply chain shifts defining the quantum hardware landscape.
Why 200mm SiC Fabs Are Failing
The 200mm SiC transition is exposing severe limitations of legacy plasma etch tools. Sharp trench corners cause 6x breakdown voltage degradation. This audit maps the failure physics, tool benchmarks, and economics of yield loss.
Why Battery Labs Need NAP-XPS
Legacy UHV-XPS creates analytical artifacts that destroy the "Yield of Discovery" for battery R&D. NAP-XPS offers 4-10x throughput gains while meeting EU 2023/1542 compliance requirements.
The $7B CAPEX Intelligence Gap
Over $7 billion in avoidable write-downs from 2024-2025. Generalist consulting missed atomic-scale physical constraints that dictate actual production yield. This report establishes the forensic intelligence framework.